Halo Industries, Inc. is a Stanford University spinout founded in 2014 that develops laser-based manufacturing technology for the semiconductor industry. The company's primary focus is silicon carbide (SiC) wafering, where its proprietary process replaces conventional mechanical wire saw slicing. The technology eliminates kerf loss - the material wasted during cutting - by up to 90%, yielding 2.2–2.3 wafers per millimetre of SiC crystal.
SiC substrates are critical components in power electronics used across electric vehicles, data centres, renewable energy systems, grid infrastructure, industrial HVAC, aerospace and defence, and augmented-reality devices. By improving material utilisation and reducing costs at the wafer level, Halo Industries addresses a key bottleneck in the supply chain for these growing sectors.
The company has raised $132m in total funding, including an $80m Series B round, reflecting investor confidence in its approach to a materials challenge that the broader semiconductor industry has struggled to solve with traditional methods.
